Micro scale metal foams for thermal management that allow for smaller and more efficient consumer and power electronics and computers
A small UK company offers technology for metal foam wicks that double the heat transfer capacity of flat heat pipes and vapour chambers without increasing their size or thermal resistance, enabling electronic devices to be faster, smaller, lighter and more reliable. The wicks can be deposited on a wide variety of pre-formed. Original electronics, computing and power devices manufacturers (OEM) and design bureaus are sought for licensing and technical cooperation.