SPAIN | ACTIS
06/11/2019
Lmite 19 Sep 2021
Oferta Tecnolgica
Ref.
TOUK20200914001
Micro scale metal foams for thermal management that allow for smaller and more efficient consumer and power electronics and computers
A small UK company offers technology for metal foam wicks that double the heat transfer capacity of flat heat pipes and vapour chambers without increasing their size or thermal resistance, enabling electronic devices to be faster, smaller, lighter and more reliable. The wicks can be deposited on a wide variety of pre-formed. Original electronics, computing and power devices manufacturers (OEM) and design bureaus are sought for licensing and technical cooperation.
Socios

logotipo CEOE Aragnlogotipo ITAINNOVAlogotipo Cmara Toledologotipo FEDAlogotipo UCLM
logotipo FUNDECYT-PCTEX logotipo ADERlogotipo FERlogotipo AINlogotipo UNAV

06/11/2019

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06/11/2019